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FAN7371 -- High-Current High-Side Gate Drive IC October 2007 FAN7371 High-Current High-Side Gate Drive IC Features Floating Channel for Bootstrap Operation to +600V 4A/4A Sourcing/Sinking Current Driving Capability Common-Mode dv/dt Noise Canceling Circuit 3.3V and 5V Input Logic Compatible Output In-phase with Input Signal Under- Voltage Lockout for VBS 25V Shunt Regulator on VDD and VBS 8-Lead Small Outline Package (SOP) Description The FAN7371 is a monolithic high-side gate drive IC, which can drive high-speed MOSFETs and IGBTs that operate up to +600V. It has a buffered output stage with all NMOS transistors designed for high pulse current driving capability and minimum cross-conduction. Fairchild's high-voltage process and common-mode noise canceling techniques provide stable operation of the high-side driver under high dv/dt noise circumstances. An advanced level-shift circuit offers high-side gate driver operation up to VS=-9.8V (typical) for VBS=15V. The UVLO circuit prevents malfunction when VBS is lower than the specified threshold voltage. The high-current and low-output voltage drop feature makes this device suitable for sustain and energy recovery circuit switches driver in the Plasma Display Panel application, motor drive inverter, switching power supply, and high-power DC-DC converter applications. 8-SOP Applications High-Speed Gate Driver Sustain Switch Driver in PDP Application Energy-Recovery Circuit Switch Driver in PDP Application High-Power Buck Converter Motor Drive Inverter Ordering Information Part Number FAN7371M Package 8-SOP Pb-Free Yes Operating Temperature Range Packing Method -40C ~ 125C TUBE TAPE & REEL FAN7371MX Note: 1 These devices passed wave soldering test by JESD22A-111. (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Typical Application Diagrams 15V VS 15V RBOOT1 DBOOT1 Q3 R3 R4 L1 5 CBOOT1 R1 DBOOT2 R2 Q1 8 7 6 5 C2 R5 CBOOT2 R6 R8 4 GND NC 5 6 Q2 Q4 R7 D1 D2 D4 CBOOT3 D3 8 7 6 5 DBOOT3 RBOOT3 FAN7371 8 VB 7 6 HO VS NC VDD 1 IN 2 FAN7371 1 VDD IN VB HO VS NC IN3 NC 3 GND 4 IN1 2 3 NC 4 GND To Pannel FAN7371 1 VDD IN VB HO VS FAN7371 8 VB 7 HO VS NC VDD 1 IN 2 C3 IN2 C1 2 IN4 3 NC NC 3 GND 4 Energy Recovery Circuit Part Sustain Drive Part FAN7371 Rev.03 Figure 1. Floated Bidirectional Switch and Half-Bridge Driver: PDP application 15V RBOOT DBOOT VIN FAN7371 1 VDD PWM C1 VB 8 HO R1 2 IN 3 NC 4 GND 7 CBOOT R2 L1 VS 6 NC 5 D1 C2 VOUT FAN7371 Rev.01 Figure 2. Step-Down (Buck) DC-DC Converter Application (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 2 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Internal Block Diagram VDD GND 1 25V VDD UVLO Shoot-through current compensated gate driver 8 VB 4 PULSE GENERATOR IN 2 110K NOISE CANCELLER R S R Q 7 25V HO 6 Pins 3 and 5 are no connection. FAN7371 Rev.04 VS Figure 3. Functional Block Diagram Pin Configuration VDD IN NC GND 1 2 3 4 8 VB HO VS NC FAN7371 7 6 5 FAN7371 Rev.01 Figure 4. Pin Configuration (Top View) Pin Definitions Pin # 1 2 3 4 5 6 7 8 Name VDD IN NC GND NC VS HO VB Supply Voltage Description Logic Input for High-Side Gate Driver Output No Connection Ground No Connection High-Voltage Floating Supply Return High-Side Driver Output High-Side Floating Supply (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 3 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. TA=25C unless otherwise specified. Symbol VS VB VHO VDD VIN dVS/dt PD JA TJMAX TSTG Notes: 2 Characteristics High-Side Floating Offset Voltage High-Side Floating Supply Voltage(2) High-Side Floating Output Voltage Low-Side and Logic Supply Voltage Logic Input Voltage Allowable Offset Voltage Slew Rate Power Dissipation(3, 4, 5) Thermal Resistance Maximum Junction Temperature Storage Temperature (2) Min. VB-VSHUNT -0.3 VS-0.3 -0.3 -0.3 Max. VB+0.3 625.0 VB+0.3 VSHUNT VDD+0.3 50 0.625 200 150 Unit V V V V V V/ns W C/W C C -55 150 3 4 5 This IC contains a shunt regulator on VDD and VBS with a normal breakdown voltage of 25V. Please note that this supply pin should not be driven by a low-impedance voltage source greater than the VSHUNT specified in the Electrical Characteristics section Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material). Refer to the following standards: JESD51-2: Integral circuits thermal test method environmental conditions, natural convection, and JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages. Do not exceed power dissipation (PD) under any circumstances. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol VB VS VHO VIN VDD TA Parameter High-Side Floating Supply Voltage High-Side Floating Supply Offset Voltage High-Side Output Voltage Logic Input Voltage Supply Voltage Operating Ambient Temperature Min. VS+10 6-VDD VS GND 10 -40 Max. VS+20 600 VB VDD 20 125 Unit V V V V V C (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 4 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Electrical Characteristics VBIAS(VDD, VBS)=15.0V, TA = 25C, unless otherwise specified. The VIN and IIN parameters are referenced to GND. The VO and IO parameters are relative to VS and are applicable to the respective output HO. Symbol IQDD IPDD Characteristics Quiescent VDD Supply Current Operating VDD Supply Current VBS Supply Under-Voltage Positive Going Threshold Voltage Test Condition VIN=0V or 5V fIN=20KHz, No Load Min. Typ. Max. Unit 25 35 70 100 A A POWER SUPPLY SECTION BOOTSTRAPPED SUPPLY SECTION VBSUV+ VBSUVVBSHYS ILK IQBS IPBS VIN=0V, VBS=Sweep 8.2 7.5 9.2 8.5 0.7 10 60 1.0 120 2.8 10.2 9.5 V V V A A mA VBS Supply Under-Voltage Negative Going VIN=0V, VBS=Sweep Threshold Voltage VBS Supply Under-Voltage Lockout Hysteresis Voltage Offset Supply Leakage Current Quiescent VBS Supply Current Operating VBS Supply Current VIN=0V, VBS=Sweep VB=VS=600V VIN=0V or 5V CLOAD=1000pF, fIN=20KHz, rms value SHUNT REGULATOR SECTION VSHUNT VDD and VBS Shunt Regulator Clamping Voltage Logic "1" Input Voltage Logic "0" Input Voltage Logic Input High Bias Current Logic Input Low Bias Current Input Pull-down Resistance High-Level Output Voltage (VBIAS - VO) Low-Level Output Voltage No Load No Load 3.0 3.0 4.0 4.0 -9.8 -7.0 VIN=5V VIN=0V 70 110 1.2 30 45 ISHUNT=5mA 24 25 V INPUT LOGIC Section VIH VIL IIN+ IINRIN VOH VOL IO+ IOVS 2.5 0.8 70 2 V V A A K V mV A A V GATE DRIVER OUTPUT SECTION Output High, Short-Circuit Pulsed Current(6) VHO=0V, VIN=5V, PW 10s Output Low, Short-Circuit Pulsed Current(6) VHO=15V,VIN=0V, PW 10s Allowable Negative VS pin Voltage for IN Signal Propagation to HO Note: 6 These parameters guaranteed by design. Dynamic Electrical Characteristics VDD=VBS=15V, GND=0V, CLOAD=1000pF, TA=25C, unless otherwise specified. Symbol ton toff tr tf Parameter Turn-on Propagation Delay Time Turn-off Propagation Delay Time Turn-on Rise Time Turn-off Fall Time VS=0V VS=0V Conditions Min. Typ. 150 150 25 15 Max. 210 210 50 40 Unit ns ns ns ns (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 5 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Typical Characteristics 250 200 250 200 tON [ns] 150 100 50 0 -40 tOFF [ns] -20 0 20 40 60 80 100 120 150 100 50 0 -40 -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 5. Turn-on Propagation Delay vs. Temp. Figure 6. Turn-off Propagation Delay vs. Temp. 50 40 50 40 30 20 10 0 -40 tR [ns] 20 10 0 -40 -20 0 20 40 60 80 100 120 tF [ns] 30 -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 7. Turn-on Rise Time vs. Temp. Figure 8. Turn-off Fall Time vs. Temp. 100 80 60 40 20 0 -40 2.0 1.5 IPBS [mA] -20 0 20 40 60 80 100 120 IPDD [A] 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 9. Operating VDD Supply Current vs. Temp. Figure 10. Operating VBS Supply Current vs. Temp. (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 6 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Typical Characteristics (Continued) 10.0 9.5 9.5 9.0 VBSUV+ [V] VBSUV- [V] 9.0 8.5 8.5 8.0 8.0 -40 -20 0 20 40 60 80 100 120 7.5 -40 -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 11. VBS UVLO+ vs. Temp. Figure 12. VBS UVLO- vs. Temp. 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 VIH [V] -20 0 20 40 60 80 100 120 VIL [V] -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 13. Logic High Input Voltage vs. Temp. Figure 14. Logic Low Input Voltage vs. Temp. 280 240 200 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -40 RIN [k] 160 120 80 40 0 -40 -20 0 20 40 60 80 100 120 VOH [V] -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 15. Input Pull-down Resistance vs. Temp. Figure 16. High-Level Output Voltage vs. Temp. (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 7 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Typical Characteristics (Continued) 6.5 6.0 5.5 5.0 6.5 6.0 5.5 5.0 IO+ [A] 4.5 4.0 3.5 3.0 2.5 -40 -20 0 20 40 60 80 100 120 IO- [A] 4.5 4.0 3.5 3.0 2.5 -40 -20 0 20 40 60 80 100 120 Temperature [C] Temperature [C] Figure 17. Output High, Short-Circuit Pulsed Current vs. Temp. Figure 18. Output Low, Short-Circuit Pulsed Current vs. Temp. 7 6 5 4 3 2 10 7 6 5 4 3 2 10 IO+ [A] 12 14 16 18 20 IO- [A] 12 14 16 18 20 VBS [V] VBS [V] Figure 19. Output High, Short-Circuit Pulsed Current vs. Supply Voltage Figure 20. Output Low, Short-Circuit Pulsed Current vs. Supply Voltage 80 120 100 60 IQDD [A] IQBS [A] -40C 40 25C 20 125C 80 60 125C 40 20 -40C 25C 0 10 12 14 16 18 20 0 10 12 14 16 18 20 Supply Voltage [V] Supply Voltage [V] Figure 21. Quiescent VDD Supply Current vs. Supply Voltage Figure 22. Quiescent VBS Supply Current vs. Supply Voltage (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 8 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Switching Time Definitions Timing Diagram 15V 50% 50% VDD 10nF 10F VB 10F 0.1F 15V IN ton tr toff tf VS GND FAN7371 1000pF 90% 90% IN HO OUT (A) 10% 10% (B) Figure 23. Switching Time Test Circuit and Waveform Definitions (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 9 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC Physical Dimensions 5.00 4.80 3.81 8 5 A 0.65 B 6.20 5.80 4.00 3.80 1.75 5.60 PIN ONE INDICATOR 1 4 1.27 0.25 M (0.33) CBA 1.27 LAND PATTERN RECOMMENDATION 0.25 0.10 1.75 MAX C 0.10 0.51 0.33 0.50 x 45 0.25 C SEE DETAIL A 0.25 0.19 OPTION A - BEVEL EDGE R0.10 R0.10 GAGE PLANE 0.36 OPTION B - NO BEVEL EDGE NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MS-012, VARIATION AA, ISSUE C, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS. D) LANDPATTERN STANDARD: SOIC127P600X175-8M. E) DRAWING FILENAME: M08AREV13 8 0 0.90 0.406 SEATING PLANE (1.04) DETAIL A SCALE: 2:1 Figure 24. 8-Lead Small Outline Package (SOP) (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 10 www.fairchildsemi.com FAN7371 -- High-Current High-Side Gate Drive IC TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Build it Now CorePLUS CROSSVOLT CTLTM Current Transfer LogicTM (R) EcoSPARK (R) (R) Fairchild (R) Fairchild Semiconductor FACT Quiet SeriesTM (R) FACT (R) FAST FastvCore FPS (R) FRFET SM Global Power Resource (R) Green FPS Green FPS e-Series GTO i-Lo IntelliMAX ISOPLANAR MegaBuckTM MICROCOUPLER MicroFET MicroPak MillerDriveTM Motion-SPMTM (R) OPTOLOGIC (R) OPTOPLANAR (R) PDP-SPMTM (R) Power220 Power247 (R) POWEREDGE Power-SPM (R) PowerTrench Programmable Active Droop (R) QFET QS QT Optoelectronics Quiet Series RapidConfigure SMART START (R) SPM STEALTHTM SuperFET SuperSOT -3 SuperSOT -6 (R) SuperSOT -8 SyncFETTM (R) The Power Franchise TinyBoost TinyBuck (R) TinyLogic TINYOPTO TinyPower TinyPWM TinyWire SerDes (R) UHC UniFET VCX DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I31 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. No Identification Needed Full Production Obsolete Not In Production (c) 2007 Fairchild Semiconductor Corporation FAN7371 Rev. 1.0.1 11 www.fairchildsemi.com |
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